New LV100-type standard package with integrated 3-level circuit

TOKYO, June 8, 2026 – Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has jointly developed a new standard package for power modules with integrated 3-level circuits,¹ designed for industrial drive equipment and renewable energy systems, in collaboration with Semikron Danfoss Elektronik GmbH & Co. KG, a leading global manufacturer of power semiconductors.

This new standard package is based on Mitsubishi Electric’s LV100-type package for high-power applications and Semikron Danfoss’s SEMITRANS20 package. By optimizing terminal layout and functions specifically for 3-level circuits while ensuring compatibility between the two companies’ products, the new package will help customers standardize their inverter designs.

As the movement toward Green Transformation (GX) accelerates to realize a decarbonized society, demand is growing for power semiconductors that efficiently convert electricity. Particularly in the industrial sector, to further reduce power consumption, there is increasing adoption of 3-level circuits, which offer higher efficiency and allow for smaller peripheral components compared to conventional 2-level circuits.

The new package, jointly developed by Mitsubishi Electric and Semikron Danfoss, incorporates a 3-level T-type circuit, contributing to higher efficiency and more compact inverter designs. Furthermore, the optimal arrangement of main electrode terminals and auxiliary control terminals specifically for 3-level T-type circuits enhances inverter design flexibility.

Moving forward, both companies will independently develop products using this new standard package, contributing to standardized inverter designs.

The package concept is scheduled to be exhibited at Power Conversion Intelligent Motion (PCIM) Expo & Conference 2026 in Nuremberg, Germany from June 9 to 11, as well as upcoming exhibitions in Japan, China and other countries.